Zarlink bags packaging deal

Zarlink Semiconductor Inc. joins the SHIFT project (smart high-integration flex technologies), which is developing next-generation packaging for emerging electronic systems, including medical devices, portable communication tools, smart cards and aerospace applications. Zarlink’s participation, centred at its Caldicot, UK, facility, will initially focus on developing packaging technology for the personal medical devices market, with components embedded in flexible materials such as polyimides promoting functionality, user comfort and convenience in implanted devices and those worn close to the body. Co-funded by the European Commission, SHIFT comprises R&D institutes, industrial flex manufacturers, end-users and a technology support agency. Zarlink’s first SHIFT-enabled product will be demonstrated in the summer of 2007.

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